UK: Semiconductor IP houses license IP blocks to fabless firms.
US: Fabless firms design complex chips with the support of EDA software.
India: Design verification teams verify specifications and layout.
US: OEMs lock in chip design for end products.
The Netherlands: Fab capital equipment make the process equipment used by fabs to manufacture chips.
Germany: Gases, specialty chemicals as well as fab consumable suppliers equip fabs with key fabrication and facility cleaning materials.
Japan: Materials companies form silicon ingots from pure silicon and slice into wafers.
Taiwan: Foundries etch 60+ layers of transistors and interconnected wires on to wafer to develop integrated circuit.
US: Test equipment firms design and make equipment used by outsourced semiconductor assembly and test (OSAT) firms to test semiconductor chips.
Malaysia: OSATs assemble, package and test semiconductor chips.
China: Electronic manufacturing service firms integrate ICs into OEM end product electronics.
Argentina: The smartphone lands in the consumer’s hands.
From ‘Harnessing the Power of the Semiconductor Value Chain’, Accenture.